Invention Grant
- Patent Title: Etching or plating process and resist ink
- Patent Title (中): 蚀刻或电镀工艺和抗墨水
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Application No.: US12375506Application Date: 2007-08-06
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Publication No.: US08999185B2Publication Date: 2015-04-07
- Inventor: Nigel Anthony Caiger
- Applicant: Nigel Anthony Caiger
- Applicant Address: US NJ Parsippany
- Assignee: Sun Chemical Corporation
- Current Assignee: Sun Chemical Corporation
- Current Assignee Address: US NJ Parsippany
- Agency: Ostrolenk Faber LLP
- Agent Charles C. Achkar
- Priority: GB0615650.9 20060807
- International Application: PCT/US2007/075253 WO 20070806
- International Announcement: WO2008/021780 WO 20080221
- Main IPC: B44C1/22
- IPC: B44C1/22 ; C09K13/00 ; H05K3/00 ; C09D11/34 ; H01L31/18 ; H05K3/06 ; H05K3/10
Abstract:
The present invention provides a process of etching or plating comprising the steps of: i) ink jet printing an alkali removeable water insoluble hot melt ink jet ink onto a substrate to form a resist image; ii) etching or plating the substrate in an aqueous acid medium; and iv) removing the resist image with an aqueous alkali.
Public/Granted literature
- US20110020970A1 ETCHING OR PLATING PROCESS AND RESIST INK Public/Granted day:2011-01-27
Information query
