Invention Grant
US08999218B2 Process for producing member having pattern, pattern transfer apparatus, and mold
有权
用于制造具有图案,图案转印装置和模具的构件的方法
- Patent Title: Process for producing member having pattern, pattern transfer apparatus, and mold
- Patent Title (中): 用于制造具有图案,图案转印装置和模具的构件的方法
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Application No.: US11410892Application Date: 2006-04-26
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Publication No.: US08999218B2Publication Date: 2015-04-07
- Inventor: Junichi Seki , Masao Majima , Nobuhito Suehira
- Applicant: Junichi Seki , Masao Majima , Nobuhito Suehira
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2005-166038 20050606
- Main IPC: B28B11/10
- IPC: B28B11/10 ; B29C43/14 ; B29C59/02 ; B82Y10/00 ; B82Y40/00 ; G03F7/00 ; B28B11/24 ; B29C35/08 ; B29C43/02

Abstract:
A process of producing a member having a pattern. The process includes preparing a first mold having a pattern surface provided with a first uneven pattern at a surface of the first mold, and preparing a second mold having a pattern surface, provided with a second uneven pattern at a surface of the second mold, including a shape portion corresponding to an outer peripheral shape of the pattern surface provided with the first uneven pattern. When the pattern is transferred onto the member in a transfer area including (i) a peripheral area, which is an area not large enough to transfer an entire first uneven pattern of the first mold, and (ii) an area inside the peripheral area, in the area inside the peripheral area, the first uneven pattern of the first mold is transferred plural times to form a pattern group of the first uneven patterns, and in the peripheral area, the second uneven pattern of the second mold, including a shape portion corresponding to an outer peripheral shape of the pattern group, is transferred.
Public/Granted literature
- US20060272535A1 Process for producing member having pattern, pattern transfer apparatus, and mold Public/Granted day:2006-12-07
Information query
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