Invention Grant
- Patent Title: Bonding agent and device for use in microfluidics
- Patent Title (中): 用于微流体的粘合剂和装置
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Application No.: US13569723Application Date: 2012-08-08
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Publication No.: US08999265B2Publication Date: 2015-04-07
- Inventor: Myra T. Koesdjojo , Vincent T. Remcho , Jintana Nammoonnoy
- Applicant: Myra T. Koesdjojo , Vincent T. Remcho , Jintana Nammoonnoy
- Applicant Address: US OR Corvallis
- Assignee: State of Oregon acting by and through the State Board of Higher Education on behalf of Oregon State University
- Current Assignee: State of Oregon acting by and through the State Board of Higher Education on behalf of Oregon State University
- Current Assignee Address: US OR Corvallis
- Agency: Klarquist Sparkman, LLP
- Main IPC: C08G63/08
- IPC: C08G63/08 ; B32B37/12 ; C09J7/02 ; C09J167/04 ; B01L3/00 ; B29C65/50 ; B29C65/00 ; B29C65/48 ; F16K99/00 ; B29C65/52 ; B29L31/00 ; B29C65/14 ; B29K705/10 ; B29K705/04 ; B29K705/14 ; B29K705/02

Abstract:
Disclosed embodiments concern a microfluidic device comprising a bonding agent and two or more components. In particular disclosed embodiments, the microfluidic device is made out of the disclosed bonding agent. Also disclosed are embodiments of a method for making a microfluidic device, wherein the method includes using the disclosed bonding agent to couple two or more components together.
Public/Granted literature
- US20130064713A1 BONDING AGENT AND DEVICE FOR USE IN MICROFLUIDICS Public/Granted day:2013-03-14
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