Invention Grant
- Patent Title: Honeycomb structure and bonded type honeycomb structure
- Patent Title (中): 蜂窝结构和粘结型蜂窝结构
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Application No.: US12717157Application Date: 2010-03-04
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Publication No.: US08999479B2Publication Date: 2015-04-07
- Inventor: Toshio Yamada , Kentaro Sugimoto
- Applicant: Toshio Yamada , Kentaro Sugimoto
- Applicant Address: JP Nagoya
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Burr & Brown, PLLC
- Priority: JP2009-079068 20090327
- Main IPC: B32B3/12
- IPC: B32B3/12 ; B01D46/24

Abstract:
A honeycomb structure includes a porous partition wall defining a plurality of cells serving as fluid passages, an outer peripheral wall located at the outermost periphery, a first cell having one end opened and the end plugged, and a second cell having the one end plugged and the other end opened. The first cells and the second cells are disposed alternately, and the area of the first cells is larger than that of the second cells in a cross section perpendicular to a center axis. The thickness of the partition wall that forms at least one cell from the outermost periphery in the outer peripheral section is 1.1 to 3.0 times the thickness of the partition wall in the center section.
Public/Granted literature
- US20100247852A1 HONEYCOMB STRUCTURE AND BONDED TYPE HONEYCOMB STRUCTURE Public/Granted day:2010-09-30
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