Invention Grant
- Patent Title: Barrier film for electronic device and method of manufacturing the same
- Patent Title (中): 电子器件阻隔膜及其制造方法
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Application No.: US13713048Application Date: 2012-12-13
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Publication No.: US08999497B2Publication Date: 2015-04-07
- Inventor: Kenichi Nagayama , Yukika Yamada , Hisanao Usami
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: JP2011-272328 20111213; KR10-2012-0095014 20120829
- Main IPC: B32B9/04
- IPC: B32B9/04 ; B32B5/16 ; H01L51/52 ; C08J7/04

Abstract:
A barrier film for an electronic device includes: a resin film; an adsorption layer disposed on a side of the resin film and including an inorganic material, which is electrostatically chargeable with a positive charge or a negative charge and having higher hydrophilicity than a surface of the resin film; and a stacked layer disposed on a side of the adsorption layer and including a plate-shaped particle layer including an inorganic plate-shaped particle, which is electrostatically chargeable with a positive charge or a negative charge, and a binder layer including a binder particle, which is electrostatically chargeable with a positive charge or a negative charge, where the plate-shaped particle layer and binder layer are alternately stacked.
Public/Granted literature
- US20130149513A1 BARRIER FILM FOR ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-06-13
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