Invention Grant
US08999502B2 Cover tape, method for manufacturing cover tape, and electronic part package
有权
覆盖带，制造覆盖带的方法和电子部件封装
- Patent Title: Cover tape, method for manufacturing cover tape, and electronic part package
- Patent Title (中): 覆盖带，制造覆盖带的方法和电子部件封装
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Application No.: US13386077Application Date: 2010-08-25
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Publication No.: US08999502B2Publication Date: 2015-04-07
- Inventor: Masayuki Yoshino , Toshihiro Koyano , Daisuke Masaki , Yutaka Matsuki
- Applicant: Masayuki Yoshino , Toshihiro Koyano , Daisuke Masaki , Yutaka Matsuki
- Applicant Address: JP Tokyo
- Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2009-199529 20090831; JP2010-026512 20100209; JP2010-147940 20100629
- International Application: PCT/JP2010/064388 WO 20100825
- International Announcement: WO2011/024860 WO 20110303
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B32B27/00 ; B29C55/00 ; C09J7/02 ; H01L21/683
Abstract:
A cover tape having a temperature at which a heat shrinkage rate in at least one of a machine direction and a transverse direction perpendicular to the machine direction is 5% or more between 80° C. to 200° C.
Public/Granted literature
- US20120276377A1 COVER TAPE, METHOD FOR MANUFACTURING COVER TAPE, AND ELECTRONIC PART PACKAGE Public/Granted day:2012-11-01
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