Invention Grant
- Patent Title: Patterning process and resist composition
- Patent Title (中): 图案化过程和抗蚀剂组成
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Application No.: US13546489Application Date: 2012-07-11
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Publication No.: US08999630B2Publication Date: 2015-04-07
- Inventor: Jun Hatakeyama , Koji Hasegawa , Kazuhiro Katayama
- Applicant: Jun Hatakeyama , Koji Hasegawa , Kazuhiro Katayama
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2011-155415 20110714
- Main IPC: G03F7/32
- IPC: G03F7/32 ; G03F7/004 ; G03F7/039 ; G03F7/11 ; G03F7/20

Abstract:
An image is formed via positive/negative reversal on organic solvent development using a photoresist film comprising a polymer comprising recurring units of isosorbide (meth)acrylate in which one hydroxyl group of isosorbide is bonded to form (meth)acrylate and the other hydroxyl group is substituted with an acid labile group and an acid generator. The resist film is characterized by a high dissolution contrast between the unexposed and exposed regions. The photoresist film is exposed to radiation and developed in an organic solvent to form a fine hole pattern with good size control and high sensitivity.
Public/Granted literature
- US20130017492A1 PATTERNING PROCESS AND RESIST COMPOSITION Public/Granted day:2013-01-17
Information query
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