Invention Grant
- Patent Title: Integrated circuit package with molded cavity
- Patent Title (中): 具有模腔的集成电路封装
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Application No.: US13463148Application Date: 2012-05-03
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Publication No.: US08999754B2Publication Date: 2015-04-07
- Inventor: Seng Guan Chow , Il Kwon Shim , Byung Joon Han
- Applicant: Seng Guan Chow , Il Kwon Shim , Byung Joon Han
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/02 ; H01L23/31 ; H01L25/16 ; H01L23/50 ; H01L23/00
Abstract:
An integrated circuit package system includes a base substrate, attaching a base die over the base substrate, attaching an integrated interposer having interposer circuit devices, over the base die, and forming a package system encapsulant having an encapsulant cavity over the integrated interposer.
Public/Granted literature
- US20120217659A1 INTEGRATED CIRCUIT PACKAGE WITH MOLDED CAVITY Public/Granted day:2012-08-30
Information query
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