Invention Grant
- Patent Title: Process of forming an electronic device including a vertical conductive structure
- Patent Title (中): 形成包括垂直导电结构的电子器件的工艺
-
Application No.: US13794150Application Date: 2013-03-11
-
Publication No.: US08999782B2Publication Date: 2015-04-07
- Inventor: Gary H. Loechelt , Gordon M. Grivna
- Applicant: Gary H. Loechelt , Gordon M. Grivna
- Applicant Address: US AZ Phoenix
- Assignee: Semiconductor Components Industries, LLC
- Current Assignee: Semiconductor Components Industries, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Abel Law Group, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78

Abstract:
An electronic device can include a buried conductive region and a semiconductor layer over the buried conductive region. The electronic device can further include a horizontally-oriented doped region and a vertical conductive region, wherein the vertical conductive region is electrically connected to the horizontally-oriented doped region and the buried conductive region. The electronic device can still further include an insulating layer overlying the horizontally-oriented doped region, and a first conductive electrode overlying the insulating layer and the horizontally-oriented doped region, wherein a portion of the vertical conductive region does not underlie the first conductive electrode. The electronic device can include a Schottky contact that allows for a Schottky diode to be connected in parallel with a transistor. Processes of forming an electronic device allow a vertical conductive region to be formed after a conductive electrode, a gate electrode, a source region, or both.
Public/Granted literature
- US20140252473A1 Electronic Device Including a Vertical Conductive Structure and a Process of Forming the Same Public/Granted day:2014-09-11
Information query
IPC分类: