Invention Grant
- Patent Title: Method for manufacturing a semiconductor component that includes a common mode choke and structure
- Patent Title (中): 包括共模扼流圈和结构的半导体部件的制造方法
-
Application No.: US12788297Application Date: 2010-05-27
-
Publication No.: US08999807B2Publication Date: 2015-04-07
- Inventor: Li Jiang , Ryan J. Hurley , Sudhama C. Shastri , Yenting Wen , Wang-Chang Albert Gu , Phillip Holland , Der Min Liou , Rong Liu , Wenjiang Zeng
- Applicant: Li Jiang , Ryan J. Hurley , Sudhama C. Shastri , Yenting Wen , Wang-Chang Albert Gu , Phillip Holland , Der Min Liou , Rong Liu , Wenjiang Zeng
- Applicant Address: US AZ Phoenix
- Assignee: Semiconductor Components Industries, LLC
- Current Assignee: Semiconductor Components Industries, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Rennie William Dover
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L23/522 ; H01L49/02 ; H01L23/66
Abstract:
A semiconductor component and methods for manufacturing the semiconductor component that includes a monolithically integrated common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.
Public/Granted literature
- US20110291231A1 METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE Public/Granted day:2011-12-01
Information query
IPC分类:
