Invention Grant
- Patent Title: Method of producing a vertically inhomogeneous platinum or gold distribution in a semiconductor substrate and in a semiconductor device
- Patent Title (中): 在半导体衬底和半导体器件中产生垂直不均匀的铂或金分布的方法
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Application No.: US13865691Application Date: 2013-04-18
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Publication No.: US08999826B2Publication Date: 2015-04-07
- Inventor: Gerhard Schmidt , Josef Bauer
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102007020039 20070427
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L21/322 ; H01L29/167 ; H01L29/36 ; H01L29/861 ; H01L21/265

Abstract:
Method of producing a vertically inhomogeneous platinum or gold distribution in a semiconductor substrate with a first and a second surface opposite the first surface, with diffusing platinum or gold into the semiconductor substrate from one of the first and second surfaces of the semiconductor substrate, removing platinum- or gold-comprising residues remaining on the one of the first and second surfaces after diffusing the platinum or gold, forming a phosphorus- or boron-doped surface barrier layer on the first or second surface, and heating the semiconductor substrate for local gettering of the platinum or gold by the phosphorus- or boron-doped surface barrier layer.
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