Invention Grant
- Patent Title: Stress liner for stress engineering
- Patent Title (中): 应力工程应力衬
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Application No.: US12133375Application Date: 2008-06-05
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Publication No.: US08999863B2Publication Date: 2015-04-07
- Inventor: Jae Gon Lee , Jingze Tian , Shyue Seng Tan , Luona Goh , Wei Lu , Elgin Quek
- Applicant: Jae Gon Lee , Jingze Tian , Shyue Seng Tan , Luona Goh , Wei Lu , Elgin Quek
- Applicant Address: SG Singapore
- Assignee: GlobalFoundries Singapore Pte. Ltd.
- Current Assignee: GlobalFoundries Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Horizon IP Pte. Ltd.
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/8238 ; H01L29/78 ; H01L29/66
Abstract:
A stress liner having first and second stress type is provided over a first type and a second type transistor to improve reliability and performance without incurring area penalties or layout deficiencies.
Public/Granted literature
- US20090302391A1 STRESS LINER FOR STRESS ENGINEERING Public/Granted day:2009-12-10
Information query
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