Invention Grant
- Patent Title: Thermally curable resin composition for protective film
- Patent Title (中): 用于保护膜的热固化树脂组合物
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Application No.: US13181142Application Date: 2011-07-12
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Publication No.: US09000086B2Publication Date: 2015-04-07
- Inventor: Soon Chun Mok , Seung Hee Lee , Jong Hwi Hwang , Beom Su Park , Sung Hyun Kim
- Applicant: Soon Chun Mok , Seung Hee Lee , Jong Hwi Hwang , Beom Su Park , Sung Hyun Kim
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: KR10-2010-0067078 20100712; KR10-2011-0059707 20110620
- Main IPC: C08L83/06
- IPC: C08L83/06 ; C09D183/06 ; C08G77/14 ; C09D183/08 ; C08L83/08 ; C08G77/26 ; C08F20/00 ; C08F20/32

Abstract:
The present invention relates to a thermally curable resin composition for a protective film including an alkoxy group-containing silane-modified epoxy resin as an essential component, a protective film of a color filter prepared from the same, and a liquid crystal display device including the same. The thermally curable resin composition for a protective film of the present invention includes an alkoxy group-containing silane-modified epoxy resin as an essential component to have excellent film strength and adhesive strength, and thus may be effectively used in a protective film of a color filter for a liquid crystal display device.
Public/Granted literature
- US20120010350A1 THERMALLY CURABLE RESIN COMPOSITION FOR PROTECTIVE FILM Public/Granted day:2012-01-12
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