Invention Grant
- Patent Title: Structure, circuit board, and circuit board manufacturing method
- Patent Title (中): 结构,电路板和电路板制造方法
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Application No.: US13583485Application Date: 2011-02-18
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Publication No.: US09000307B2Publication Date: 2015-04-07
- Inventor: Hiroshi Toyao , Naoki Kobayashi , Noriaki Ando
- Applicant: Hiroshi Toyao , Naoki Kobayashi , Noriaki Ando
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: JP2010-051086 20100308
- International Application: PCT/JP2011/000905 WO 20110218
- International Announcement: WO2011/111311 WO 20110915
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/03 ; H05K1/09 ; H05K1/14 ; H01K3/10 ; H05K1/02 ; H01P3/00

Abstract:
The disclosed structure (10) is provided with: at least three conductors (111, 131, 151) which face one-another; a through-via (101) which passes through each of the conductors (111, 131, 151); openings (112, 152) which are provided so as to surround the circumference of the through-via (101); and conductor elements (121, 141) which are located in different layers to those in which the conductors (111, 131, 151) are located, and which are connected to the through-via (101). Facing opening 112 is conductor element 121, which is larger than said opening (112), and facing opening 152 is conductor element 141, which is larger than said opening (152).
Public/Granted literature
- US20120325544A1 STRUCTURE, CIRCUIT BOARD, AND CIRCUIT BOARD MANUFACTURING METHOD Public/Granted day:2012-12-27
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