Invention Grant
- Patent Title: Light-emitting device, flexible light-emitting device, electronic device, lighting apparatus, and method of manufacturing light-emitting device and flexible-light emitting device
- Patent Title (中): 发光装置,柔性发光装置,电子装置,照明装置以及制造发光装置和柔性发光装置的方法
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Application No.: US13005768Application Date: 2011-01-13
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Publication No.: US09000443B2Publication Date: 2015-04-07
- Inventor: Kaoru Hatano
- Applicant: Kaoru Hatano
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2010-010421 20100120
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L51/52 ; H01L27/12 ; H01L27/32

Abstract:
An object is to provide a light-emitting device or a flexible light-emitting device having low surface temperature, a long lifetime, and high reliability. Another object is to provide a simple method of manufacturing the light-emitting device or the flexible light-emitting device. Provided is a light-emitting device or a flexible light-emitting device which includes: a substrate having a light-transmitting property with respect to visible light; a first adhesive layer provided over the substrate; an insulating layer located over the first adhesive layer; a light-emitting element comprising a first electrode formed over the insulating layer, a second electrode facing the first electrode, and a layer including an organic compound having a light-emitting property between the first electrode and the second electrode, a second adhesive layer formed over the second electrode; a metal substrate provided over the second adhesive layer; and a heat radiation material layer formed over the metal substrate.
Public/Granted literature
Information query
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