Invention Grant
- Patent Title: Silicon carbide semiconductor device
- Patent Title (中): 碳化硅半导体器件
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Application No.: US13613838Application Date: 2012-09-13
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Publication No.: US09000447B2Publication Date: 2015-04-07
- Inventor: Keiji Wada , Takeyoshi Masuda , Toru Hiyoshi
- Applicant: Keiji Wada , Takeyoshi Masuda , Toru Hiyoshi
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Tamatane J. Aga
- Priority: JP2011-208679 20110926
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L21/04 ; H01L29/66 ; H01L29/04 ; H01L29/78 ; H01L29/16 ; H01L29/423 ; H01L29/06

Abstract:
A first layer has n type conductivity. A second layer is epitaxially formed on the first layer and having p type conductivity. A third layer is on the second layer and having n type conductivity. ND is defined to represent a concentration of a donor type impurity. NA is defined to represent a concentration of an acceptor type impurity. D1 is defined to represent a location in the first layer away from an interface between the first layer and the second layer in a depth direction. D1 in which 1≦ND/NA≦50 is satisfied is within 1 μm therefrom. A gate trench is provided to extend through the third layer and the second layer to reach the first layer. A gate insulating film covers a side wall of the gate trench. A gate electrode is embedded in the gate trench with the gate insulating film interposed therebetween.
Public/Granted literature
- US20130075759A1 SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2013-03-28
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