Invention Grant
- Patent Title: Silicon carbide semiconductor device
- Patent Title (中): 碳化硅半导体器件
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Application No.: US13884956Application Date: 2011-03-29
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Publication No.: US09000448B2Publication Date: 2015-04-07
- Inventor: Hirotaka Hamamura , Yasuhiro Shimamoto , Hiroyuki Okino
- Applicant: Hirotaka Hamamura , Yasuhiro Shimamoto , Hiroyuki Okino
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge P.C.
- International Application: PCT/JP2011/057787 WO 20110329
- International Announcement: WO2012/131898 WO 20121004
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/66 ; H01L29/51 ; H01L29/78 ; H01L29/16

Abstract:
A MOSFET having a high mobility may be obtained by introducing nitrogen to the channel region or the interface between the gate dielectric film and the SiC substrate of the SiC MOSFET, but there is a problem that a normally-on MOSFET is obtained. For realizing both a high mobility and normally-off, and for providing a SiC MOSFET having further high reliability, nitrogen is introduced to the channel region of the SiC substrate or the interface between the gate dielectric film and the SiC substrate, and furthermore a metal oxide film having a thickness of 10%, or less of the total thickness of the gate dielectric film is inserted in the gate dielectric film.
Public/Granted literature
- US20130234163A1 SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2013-09-12
Information query
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