Invention Grant
- Patent Title: Semiconductor integrated circuit, electronic device, solid-state imaging apparatus, and imaging apparatus
- Patent Title (中): 半导体集成电路,电子器件,固态成像装置和成像装置
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Application No.: US13218933Application Date: 2011-08-26
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Publication No.: US09000501B2Publication Date: 2015-04-07
- Inventor: Yoshiharu Kudoh
- Applicant: Yoshiharu Kudoh
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Sheridan Ross P.C.
- Priority: JP2010-197730 20100903
- Main IPC: H01L31/02
- IPC: H01L31/02 ; H01L27/146

Abstract:
A semiconductor integrated circuit includes a first semiconductor substrate in which a part of an analog circuit is formed between the analog circuit and a digital circuit which subjects an analog output signal output from the analog circuit to digital conversion; a second semiconductor substrate in which the remaining part of the analog circuit and the digital circuit are formed; and a substrate connection portion which connects the first and second semiconductor substrates to each other. The substrate connection portion transmits an analog signal which is generated by a part of the analog circuit of the first semiconductor substrate to the second semiconductor substrate.
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