Invention Grant
US09000501B2 Semiconductor integrated circuit, electronic device, solid-state imaging apparatus, and imaging apparatus 有权
半导体集成电路,电子器件,固态成像装置和成像装置

  • Patent Title: Semiconductor integrated circuit, electronic device, solid-state imaging apparatus, and imaging apparatus
  • Patent Title (中): 半导体集成电路,电子器件,固态成像装置和成像装置
  • Application No.: US13218933
    Application Date: 2011-08-26
  • Publication No.: US09000501B2
    Publication Date: 2015-04-07
  • Inventor: Yoshiharu Kudoh
  • Applicant: Yoshiharu Kudoh
  • Applicant Address: JP
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP
  • Agency: Sheridan Ross P.C.
  • Priority: JP2010-197730 20100903
  • Main IPC: H01L31/02
  • IPC: H01L31/02 H01L27/146
Semiconductor integrated circuit, electronic device, solid-state imaging apparatus, and imaging apparatus
Abstract:
A semiconductor integrated circuit includes a first semiconductor substrate in which a part of an analog circuit is formed between the analog circuit and a digital circuit which subjects an analog output signal output from the analog circuit to digital conversion; a second semiconductor substrate in which the remaining part of the analog circuit and the digital circuit are formed; and a substrate connection portion which connects the first and second semiconductor substrates to each other. The substrate connection portion transmits an analog signal which is generated by a part of the analog circuit of the first semiconductor substrate to the second semiconductor substrate.
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