Invention Grant
- Patent Title: Body contact SOI transistor structure and method of making
- Patent Title (中): 体接触SOI晶体管结构及制作方法
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Application No.: US13583923Application Date: 2011-04-19
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Publication No.: US09000521B2Publication Date: 2015-04-07
- Inventor: Dongping Wu , Shili Zhang
- Applicant: Dongping Wu , Shili Zhang
- Applicant Address: CN Shanghai
- Assignee: Fudan University
- Current Assignee: Fudan University
- Current Assignee Address: CN Shanghai
- Agent Jamie J. Zheng, Esq.
- Priority: CN201010153461 20100422
- International Application: PCT/CN2011/000679 WO 20110419
- International Announcement: WO2011/131028 WO 20111027
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/74 ; H01L29/786 ; H01L29/66

Abstract:
The present invention puts forward a body-contact SOI transistor structure and method of making. The method comprises: forming a hard mask layer on the SOI; etching an opening exposing SOI bottom silicon; wet etching an SOI oxide layer through the opening; depositing a polysilicon layer at the opening followed by anisotropic dry etching; depositing an insulating dielectric layer at the opening followed by planarization; forming a gate stack structure by deposition and etching, and forming source/drain junctions of the transistor using ion implantation. By using the present invention, body contact for SOI field-effect transistors can be effectively formed, thereby eliminating floating-body effect in the SOI field-effect transistors, and improving heat dissipation capability of the SOI transistors and associated integrated circuits.
Public/Granted literature
- US20130026573A1 BODY CONTACT SOI TRANSISTOR STRUCTURE AND METHOD OF MAKING Public/Granted day:2013-01-31
Information query
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