Invention Grant
US09000521B2 Body contact SOI transistor structure and method of making 有权
体接触SOI晶体管结构及制作方法

  • Patent Title: Body contact SOI transistor structure and method of making
  • Patent Title (中): 体接触SOI晶体管结构及制作方法
  • Application No.: US13583923
    Application Date: 2011-04-19
  • Publication No.: US09000521B2
    Publication Date: 2015-04-07
  • Inventor: Dongping WuShili Zhang
  • Applicant: Dongping WuShili Zhang
  • Applicant Address: CN Shanghai
  • Assignee: Fudan University
  • Current Assignee: Fudan University
  • Current Assignee Address: CN Shanghai
  • Agent Jamie J. Zheng, Esq.
  • Priority: CN201010153461 20100422
  • International Application: PCT/CN2011/000679 WO 20110419
  • International Announcement: WO2011/131028 WO 20111027
  • Main IPC: H01L27/12
  • IPC: H01L27/12 H01L21/74 H01L29/786 H01L29/66
Body contact SOI transistor structure and method of making
Abstract:
The present invention puts forward a body-contact SOI transistor structure and method of making. The method comprises: forming a hard mask layer on the SOI; etching an opening exposing SOI bottom silicon; wet etching an SOI oxide layer through the opening; depositing a polysilicon layer at the opening followed by anisotropic dry etching; depositing an insulating dielectric layer at the opening followed by planarization; forming a gate stack structure by deposition and etching, and forming source/drain junctions of the transistor using ion implantation. By using the present invention, body contact for SOI field-effect transistors can be effectively formed, thereby eliminating floating-body effect in the SOI field-effect transistors, and improving heat dissipation capability of the SOI transistors and associated integrated circuits.
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