Invention Grant
- Patent Title: Semiconductor device with corner tie bars
- Patent Title (中): 带角接头的半导体器件
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Application No.: US13939183Application Date: 2013-07-11
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Publication No.: US09000570B2Publication Date: 2015-04-07
- Inventor: Weng Hoong Chan , Ly Hoon Khoo , Boon Yew Low
- Applicant: Weng Hoong Chan , Ly Hoon Khoo , Boon Yew Low
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent Charles Bergere
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/82
Abstract:
A Quad Flat Pack (QFP) type semiconductor device includes four corner tie bars that, instead of being trimmed, are used for power and/or ground connections, and alternatively, to control mold flow during the encapsulation step of the assembly process.
Public/Granted literature
- US20150014831A1 SEMICONDUCTOR DEVICE WITH CORNER TIE BARS Public/Granted day:2015-01-15
Information query
IPC分类:
