Invention Grant
- Patent Title: Package systems having an opening in a substrate thereof and manufacturing methods thereof
- Patent Title (中): 在其基材中具有开口的封装体系及其制造方法
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Application No.: US12900718Application Date: 2010-10-08
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Publication No.: US09000578B2Publication Date: 2015-04-07
- Inventor: Chia-Pao Shu , Chun-wen Cheng , Kuei-Sung Chang
- Applicant: Chia-Pao Shu , Chun-wen Cheng , Kuei-Sung Chang
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; B81C1/00 ; H01L23/00 ; H01L25/065
Abstract:
A package system includes a first substrate and a second substrate. The second substrate is electrically coupled with the first substrate. The second substrate includes at least one first opening. At least one electrical bonding material is disposed between the first substrate and the second substrate. A first portion of the at least one electrical bonding material is at least partially filled in the at least one first opening.
Public/Granted literature
- US20120086126A1 PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF Public/Granted day:2012-04-12
Information query
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