Invention Grant
- Patent Title: Method for self-assembly of substrates and devices obtained thereof
- Patent Title (中): 获得的基板和装置的自组装方法
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Application No.: US13975811Application Date: 2013-08-26
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Publication No.: US09000588B2Publication Date: 2015-04-07
- Inventor: Philippe Soussan , Wenqi Zhang , Silvia Armini
- Applicant: IMEC
- Applicant Address: BE Leuven
- Assignee: IMEC
- Current Assignee: IMEC
- Current Assignee Address: BE Leuven
- Agency: McDonnell Boehnen Hulbert & Berghoff LLP
- Priority: EP12181742 20120824
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L25/00

Abstract:
A method for defining regions with different surface liquid tension properties on a substrate is disclosed. The method includes: providing a substrate with a main surface having a first surface liquid tension property that is at least partially covered with a seed layer; forming at least one micro-bump on the seed layer leaving part of the seed layer exposed; patterning the exposed seed layer to expose part of the main surface; forming at least one closed-loop structure that encloses a region of the main surface and the at least one micro-bump; and chemically treating the main surface of the substrate to provide on a surface of at least one closed-loop structure and the at least one micro-bump a second surface liquid tension property. The second surface liquid tension property is substantially different from the first surface liquid tension property of the main surface and is liquid phobic.
Public/Granted literature
- US20140054771A1 Method for Self-Assembly of Substrates and Devices Obtained Thereof Public/Granted day:2014-02-27
Information query
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