Invention Grant
- Patent Title: Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures
- Patent Title (中): 使用石墨烯来限制互连结构中的铜表面氧化，扩散和电迁移
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Application No.: US14107100Application Date: 2013-12-16
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Publication No.: US09000594B2Publication Date: 2015-04-07
- Inventor: John A. Ott , Ageeth A. Bol
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/522 ; H01L23/532
Abstract:
A contiguous layer of graphene is formed on exposed sidewall surfaces and a topmost surface of a copper-containing structure that is present on a surface of a substrate. The presence of the contiguous layer of graphene on the copper-containing structure reduces copper oxidation and surface diffusion of copper ions and thus improves the electromigration resistance of the structure. These benefits can be obtained using graphene without increasing the resistance of copper-containing structure.
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