Invention Grant
- Patent Title: Multilayer ceramic capacitor and circuit board with multilayer ceramic capacitor mounted thereon
- Patent Title (中): 多层陶瓷电容器和安装有多层陶瓷电容器的电路板
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Application No.: US13739681Application Date: 2013-01-11
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Publication No.: US09001491B2Publication Date: 2015-04-07
- Inventor: Ki Yong Lee , Sang Hyuk Kim , Min Gon Lee , Sung Hyung Kang , Jae Yeol Choi
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0148251 20121218
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/228 ; H01G4/012 ; H01G4/232 ; H01G4/12

Abstract:
A multilayer ceramic capacitor includes a ceramic body having first and second main surfaces opposing one another, first and second lateral surfaces opposing one another, and first and second end surfaces opposing one another. First and second internal electrodes have an overlap region with lead out portions exposed to the first lateral surface of the ceramic body. An insulating layer is formed to cover the overlap region of the lead out portions exposed to the first lateral surface of the ceramic body; and first and second external electrodes are formed on the first lateral surface of the ceramic body on which the insulating layer is formed and electrically connected to the first and second internal electrodes. Thicknesses of the insulating layer from the first lateral surface and the first and second external electrodes from the first lateral surface are specified.
Public/Granted literature
- US20140168851A1 MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD WITH MULTILAYER CERAMIC CAPACITOR MOUNTED THERE ON Public/Granted day:2014-06-19
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