Invention Grant
- Patent Title: Electrode sintered body, multilayer electronic device, internal electrode paste, a manufacturing method of electrode sintered body and a manufacturing method of multilayer electronic device
- Patent Title (中): 电极烧结体，多层电子器件，内部电极糊，电极烧结体的制造方法以及多层电子器件的制造方法
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Application No.: US13396154Application Date: 2012-02-14
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Publication No.: US09001492B2Publication Date: 2015-04-07
- Inventor: Ryuji Fujisawa , Mayumi Suzuki , Kyotaro Abe
- Applicant: Ryuji Fujisawa , Mayumi Suzuki , Kyotaro Abe
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2011-042051 20110228; JP2011-239842 20111101
- Main IPC: H01G4/008
- IPC: H01G4/008 ; H01G4/06 ; H01G4/12 ; H01G4/30 ; B22F7/04 ; C22C1/04 ; B22F3/10
Abstract:
An object of the present invention is to provide an electrode sintered body wherein shrinkage is prohibited and conductivity is good. An electrode sintered body including intermetallic compound comprising nickel and aluminum is provided. And then an internal electrode paste, which can inhibit shrinkage of an internal electrode layer, is manufactured by raising sintering temperature of conducting particle materials constituting internal electrode sheet to be internal electrode layers after firing. Further, a high-function multilayer electronic device using electrode paste for internal electrodes is manufactured.
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