Invention Grant
- Patent Title: Multilayered ceramic electronic component and manufacturing method of the same
- Patent Title (中): 多层陶瓷电子元件及其制造方法相同
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Application No.: US13685194Application Date: 2012-11-26
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Publication No.: US09001493B2Publication Date: 2015-04-07
- Inventor: Sung Woo Kim , Jae Yeol Choi , Yu Na Kim , Jong Ho Lee
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0078848 20120719
- Main IPC: H01G4/06
- IPC: H01G4/06 ; H01G7/00 ; H01G4/30 ; H01G4/12

Abstract:
There is provided a multilayered ceramic electronic component including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one of the dielectric layers and alternately exposed through both ends of the ceramic body in a stacking direction of the ceramic body; an a step compensation cover including a ceramic material having a viscosity higher than that of a ceramic material included in the ceramic body and formed on at least one of an upper surface and a lower surface of the ceramic body.
Public/Granted literature
- US20140022690A1 MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2014-01-23
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