Invention Grant
US09001523B2 Carrier device, arrangement comprising such a carrier device, and method for patterning a layer stack comprising at least one ceramic layer
有权
载体装置，包括这种载体装置的布置，以及用于图案化包括至少一个陶瓷层的层叠层的方法
- Patent Title: Carrier device, arrangement comprising such a carrier device, and method for patterning a layer stack comprising at least one ceramic layer
- Patent Title (中): 载体装置，包括这种载体装置的布置，以及用于图案化包括至少一个陶瓷层的层叠层的方法
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Application No.: US13391974Application Date: 2010-08-11
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Publication No.: US09001523B2Publication Date: 2015-04-07
- Inventor: Sebastian Brunner , Gerhard Fuchs , Annette Fischer , Manfred Fischer , Christian Faistauer , Guenter Pudmich , Edmund Payr , Stefan Leopold Hatzl
- Applicant: Sebastian Brunner , Gerhard Fuchs , Annette Fischer , Manfred Fischer , Christian Faistauer , Guenter Pudmich , Edmund Payr , Stefan Leopold Hatzl
- Applicant Address: DE Munich
- Assignee: Epcos AG
- Current Assignee: Epcos AG
- Current Assignee Address: DE Munich
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102009038674 20090824
- International Application: PCT/EP2010/061708 WO 20100811
- International Announcement: WO2011/023556 WO 20110303
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01L21/48 ; H01L23/15 ; H01L23/498
Abstract:
A method for patterning a layer stack with at least one ceramic layer includes providing the ceramic layer, which has at least one plated-through hole. An electrically conductive layer is applied above the ceramic layer, such that the electrically conductive layer is electrically coupled to the at least one plated-through hole. A further layer is deposited onto the electrically conductive layer in the region of the at least one plated-through hole, wherein the further layer includes nickel. The electrically conductive layer is removed outside the region of the at least one plated-through hole. A carrier device patterned in this way can be electrically and mechanically coupled to an electronic component.
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