Invention Grant
US09001547B2 Semiconductor apparatus, test method using the same and muti chips system
有权
半导体装置，使用相同和多芯片系统的测试方法
- Patent Title: Semiconductor apparatus, test method using the same and muti chips system
- Patent Title (中): 半导体装置，使用相同和多芯片系统的测试方法
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Application No.: US13846864Application Date: 2013-03-18
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Publication No.: US09001547B2Publication Date: 2015-04-07
- Inventor: Dae Suk Kim
- Applicant: SK Hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Patent Ltd.
- Priority: KR10-2012-0149910 20121220
- Main IPC: G11C5/00
- IPC: G11C5/00 ; G11C29/00 ; H01L23/498 ; G11C29/26 ; G11C29/40 ; H01L23/48
Abstract:
A semiconductor apparatus includes a test unit including: a data determination unit configured to receive a plurality of data, determine whether the plurality of data are identical or not, and output the determination result as a compression signal; and an output control unit configured to output the compression signal as a test result in response to a test mode signal and a die activation signal.
Public/Granted literature
- US20140177365A1 SEMICONDUCTOR APPARATUS, TEST METHOD USING THE SAME AND MUTI CHIPS SYSTEM Public/Granted day:2014-06-26
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