Invention Grant
- Patent Title: Sub-block decoding in 3D memory
- Patent Title (中): 3D存储器中的子块解码
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Application No.: US13781016Application Date: 2013-02-28
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Publication No.: US09001584B2Publication Date: 2015-04-07
- Inventor: Chang Wan Ha
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G11C16/04
- IPC: G11C16/04

Abstract:
Some embodiments relate to apparatuses and methods associated with blocks of memory cells. The blocks of memory cells may include two or more sub-blocks of memory cells. Sub-blocks may comprise a vertical string of memory cells including a source select transistor and a drain select transistor. An apparatus may include two or more drain select lines, of which a first drain select line is coupled to a drain select transistor in a first sub-block of a first block and to a drain select transistor in a first sub-block of a second block. A second drain select line in the apparatus may be coupled to a drain select transistor in a second sub-block of the first block and to a drain select transistor in a second sub-block of the second block. Other apparatuses and methods are described.
Public/Granted literature
- US20140241060A1 SUB-BLOCK DECODING IN 3D MEMORY Public/Granted day:2014-08-28
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