Invention Grant
- Patent Title: Heating member and fusing device including the same
- Patent Title (中): 加热构件和包括其的定影装置
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Application No.: US13904233Application Date: 2013-05-29
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Publication No.: US09002253B2Publication Date: 2015-04-07
- Inventor: Yoon-chul Son , Dong-earn Kim , Dong-ouk Kim , Ha-jin Kim , Sung-hoon Park , Min-jong Bae , Sang-eui Lee , Kun-mo Chu
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2012-0125082 20121106
- Main IPC: G03G15/20
- IPC: G03G15/20 ; H05B3/03 ; H05B3/14 ; H05B3/46

Abstract:
A heating member includes: a resistive heating layer including: a medium-passing area, and non-medium-passing areas respectively on opposing sides of the medium-passing area at opposing side portions of the resistive heating layer; a core which supports the resistive heating layer; a thermally conductive layer between the resistive heating layer and the core, and disposed in a non-medium passing area at a side portion of the resistive heating layer; and an electrode which is between the resistive heating layer and the core, contacts the side portion of the resistive heating layer and supplies current to the resistive heating layer. A ratio of a contact area between the thermally conductive layer and the resistive heating layer to an area of the non-medium-passing area in which the thermally conductive layer is disposed, ranges from about 5% to about 25%.
Public/Granted literature
- US20140126940A1 HEATING MEMBER AND FUSING DEVICE INCLUDING THE SAME Public/Granted day:2014-05-08
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