Invention Grant
- Patent Title: Superconducting film-forming substrate, superconducting wire, and superconducting wire manufacturing method
- Patent Title (中): 超导成膜基板,超导线及超导线制造方法
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Application No.: US14236188Application Date: 2013-02-06
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Publication No.: US09002424B2Publication Date: 2015-04-07
- Inventor: Yoshinori Nagasu , Masaru Higuchi , Hisaki Sakamoto
- Applicant: Furukawa Electric Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Furukawa Electric Co., Ltd.
- Current Assignee: Furukawa Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Amin, Turocy & Watson, LLP
- Priority: JP2012-092803 20120416
- International Application: PCT/JP2013/052755 WO 20130206
- International Announcement: WO2013/157286 WO 20131024
- Main IPC: H01L39/24
- IPC: H01L39/24 ; H01B12/04 ; H01B13/30

Abstract:
A tape-shaped superconducting film-forming substrate is disclosed, which includes a film-forming face for forming a laminate including a superconducting layer thereon, a rear face that is a face at a side opposite to the film-forming face, a pair of end faces connected to the film-forming face and the rear face, and a pair of side faces connected to the film-forming face, the rear face, and the pair of end faces, in which each of the pair of side faces includes a spreading face that spreads toward an outer side in an in-plane direction of the film-forming face from an edge part of the film-forming face toward the rear face side. A superconducting wire and a superconducting wire manufacturing method are also disclosed.
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