Invention Grant
- Patent Title: Device for predicting deformation behavior of rubber material and method for predicting deformation behavior of rubber material
- Patent Title (中): 橡胶材料变形特性预测装置及预测橡胶材料变形行为的方法
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Application No.: US13147493Application Date: 2010-02-02
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Publication No.: US09002687B2Publication Date: 2015-04-07
- Inventor: Satoshi Hamatani , Keizo Akutagawa , Hiroshi Shima
- Applicant: Satoshi Hamatani , Keizo Akutagawa , Hiroshi Shima
- Applicant Address: JP Tokyo
- Assignee: Bridgestone Corporation
- Current Assignee: Bridgestone Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-022923 20090203
- International Application: PCT/JP2010/051733 WO 20100202
- International Announcement: WO2010/090295 WO 20100812
- Main IPC: G06G7/48
- IPC: G06G7/48 ; G06F17/50 ; G06F7/60 ; G01N3/00

Abstract:
The present invention relates to a method for predicting a deformation behavior of a rubber material capable of accurately analyzing a deformation behavior of a rubber material even in a micro level, and more specifically, to a method for predicting a deformation behavior of a rubber material, including: generating a three-dimensional model of the rubber material formed by adding a filler to a rubber; applying a configuration condition specifying a relationship between a stress and a strain on the basis of thickness information and temperature information obtained on the basis of a molecular dynamics approach to a rubber layer portion constituting the three-dimensional model; and, analyzing the deformation behavior of the rubber material. Further, in the method for predicting a deformation behavior of a rubber material, it is preferable that the deformation behavior of the rubber material is analyzed by applying a finite element method to the three-dimensional model to which the configuration condition is applied.
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