Aspects of the disclosure provide an integrated circuit (IC) chip. The IC chip includes a memory module that includes one or more memory blocks. Each memory block includes a memory array having a first memory portion and a redundant memory portion, a failed memory indicator that, in response to a memory test, is configured to provide an indication of a failed memory portion in the first memory portion, and a wrapper circuit that, in response to the indication of the failed memory portion, is configured to repair the memory array by using the redundant portion instead of the failed memory portion.