Invention Grant
- Patent Title: Semiconductor integrated circuit design supporting apparatus, method, and program
- Patent Title (中): 半导体集成电路设计支持设备,方法和程序
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Application No.: US14132826Application Date: 2013-12-18
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Publication No.: US09003352B2Publication Date: 2015-04-07
- Inventor: Ryo Yamamoto , Noriyuki Minegishi
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Chiyoda-ku
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-286809 20121228; JP2013-231732 20131108
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A latency adjusting part calculates a necessary delay based on the number of FFs that are required to be inserted between respective modules through high level synthesis of a behavioral description. An input FF stage number acquiring part extracts a pin having an input that receives an FF, and acquires the number of stages of input FFs of FF reception. A latency re-adjusting part obtains an optimum delay based on the above-mentioned necessary delay and input delay. A former-stage module analyzing part detects, based on the above-mentioned synthetic log or HDL, a state having a minimum total number of FFs. An FF insertion optimizing synthesis part subjects an entire circuit to high level synthesis again based on the above-mentioned optimum delay and an FF inserting position obtained based on the state having the minimum number of FFs, to thereby obtain optimized HDL.
Public/Granted literature
- US20140189633A1 SEMICONDUCTOR INTEGRATED CIRCUIT DESIGN SUPPORTING APPARATUS, METHOD, AND PROGRAM Public/Granted day:2014-07-03
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