Invention Grant
US09003561B1 Device and method for measuring distribution of atomic resolution deformation
有权
用于测量原子分辨率变形分布的装置和方法
- Patent Title: Device and method for measuring distribution of atomic resolution deformation
- Patent Title (中): 用于测量原子分辨率变形分布的装置和方法
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Application No.: US14249424Application Date: 2014-04-10
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Publication No.: US09003561B1Publication Date: 2015-04-07
- Inventor: Bong Kyun Jang , Jae-Hyun Kim , Hak Joo Lee , Kyung-Suk Kim , Chien-Kai Wang
- Applicant: Korea Institute of Machinery & Materials , Brown University
- Applicant Address: KR Daejeon US RI Providence
- Assignee: Korea Institute of Machinery & Materials,Brown University
- Current Assignee: Korea Institute of Machinery & Materials,Brown University
- Current Assignee Address: KR Daejeon US RI Providence
- Agency: Lexyoume IP Meister, PLLC
- Main IPC: G01Q70/06
- IPC: G01Q70/06 ; G01Q20/02

Abstract:
The present invention relates to an atomic resolution deformation distribution measurement device that can measure a deformation rate of an atomic scale with low expense by improving resolution using an AFM system, and the atomic resolution deformation distribution measurement device includes: a laser source generating a laser beam; a first cantilever and a second cantilever provided close to a measurement specimen or a reference specimen to cause deformation by an atomic force; an optical system controlling a light path of the laser beam so as to cause the laser beam to be sequentially reflected to the first cantilever and the second cantilever and locate the first cantilever and the second cantilever to an image point; a measurement unit measuring the laser beam reflected from the second cantilever; and a stage on which a measurement specimen or a reference specimen is located and movable in X, Y, and Z axis directions.
Public/Granted literature
- US20150121575A1 DEVICE AND METHOD FOR MEASURING DISTRIBUTION OF ATOMIC RESOLUTION DEFORMATION Public/Granted day:2015-04-30
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