Invention Grant
- Patent Title: Method for the production of a ceramic multilayer circuit arrangement
- Patent Title (中): 制造陶瓷多层电路装置的方法
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Application No.: US12594183Application Date: 2008-02-07
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Publication No.: US09003653B2Publication Date: 2015-04-14
- Inventor: Juergen Egerter , Walter Roethlingshoefer , Markus Werner
- Applicant: Juergen Egerter , Walter Roethlingshoefer , Markus Werner
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102007015399 20070330
- International Application: PCT/EP2008/051485 WO 20080207
- International Announcement: WO2008/119582 WO 20081009
- Main IPC: H01K3/22
- IPC: H01K3/22 ; H01L21/48 ; H05K3/46 ; H05K1/03

Abstract:
A method for producing a ceramic multilayer circuit system, and a corresponding multilayer circuit system are provided. An embodiment of the method includes sequential deposition of a plurality of circuit layers of the multilayer circuit system on a substrate using a powder spray method; pressing of the deposited plurality of circuit layers; and thermal sintering of the pressed plurality of circuit layers. The individual circuit layers have electrically conductive areas made of at least one conductive material and electrically insulating areas made of at least one ceramic material.
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