Invention Grant
- Patent Title: Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material
- Patent Title (中): 使用牺牲约束材料制造用于印刷电路板的Z定向部件的方法
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Application No.: US13528097Application Date: 2012-06-20
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Publication No.: US09009954B2Publication Date: 2015-04-21
- Inventor: Keith Bryan Hardin , Paul Kevin Hall , Zachary Charles Nathan Kratzer , Qing Zhang
- Applicant: Keith Bryan Hardin , Paul Kevin Hall , Zachary Charles Nathan Kratzer , Qing Zhang
- Applicant Address: US KY Lexington
- Assignee: Lexmark International, Inc.
- Current Assignee: Lexmark International, Inc.
- Current Assignee Address: US KY Lexington
- Agent Justin M Tromp
- Main IPC: H01R43/00
- IPC: H01R43/00 ; H05K1/18 ; H01G4/33 ; H01G4/35 ; H05K1/02 ; H05K3/40

Abstract:
A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes forming the Z-directed component in a cavity formed by a constraining material that defines the outer shape of the Z-directed component. The constraining material is dissipated to release the Z-directed component from the constraining material and the Z-directed component is fired.
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