Invention Grant
- Patent Title: Method for placing a component on a substrate
- Patent Title (中): 将部件放置在基板上的方法
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Application No.: US13713539Application Date: 2012-12-13
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Publication No.: US09009957B2Publication Date: 2015-04-21
- Inventor: Johannes Hubertus Antonius Van de Rijdt
- Applicant: Johannes Hubertus Antonius Van de Rijdt
- Applicant Address: NL
- Assignee: Assembleon B.V.
- Current Assignee: Assembleon B.V.
- Current Assignee Address: NL
- Agency: Barnes & Thornburg LLP
- Main IPC: H05K3/30
- IPC: H05K3/30 ; B23P19/04 ; H05K13/04
Abstract:
A method is provided for placing a component on a substrate. The method uses a component feeding device and a component pick-and-place device to place a component on a substrate.
Public/Granted literature
- US20130097835A1 METHOD FOR PLACING A COMPONENT ON A SUBSTRATE Public/Granted day:2013-04-25
Information query
