Invention Grant
US09010405B1 Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices
有权
流体冷却散热片具有改进的翅片面积和效率,用于冷却各种设备
- Patent Title: Fluid-cooled heat sink with improved fin areas and efficiencies for use in cooling various devices
- Patent Title (中): 流体冷却散热片具有改进的翅片面积和效率,用于冷却各种设备
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Application No.: US13021853Application Date: 2011-02-07
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Publication No.: US09010405B1Publication Date: 2015-04-21
- Inventor: Desikan Bharathan , Kevin Bennion , Kenneth Kelly , Sreekant Narumanchi
- Applicant: Desikan Bharathan , Kevin Bennion , Kenneth Kelly , Sreekant Narumanchi
- Applicant Address: US DC Washington
- Assignee: U.S. Department of Energy
- Current Assignee: U.S. Department of Energy
- Current Assignee Address: US DC Washington
- Agent James B. Potts; Brian J. Lally; John T. Lucas
- Main IPC: F28F7/00
- IPC: F28F7/00 ; F25D31/00

Abstract:
The disclosure provides a fluid-cooled heat sink having a heat transfer base and a plurality of heat transfer fins in thermal communication with the heat transfer base, where the heat transfer base and the heat transfer fins form a central fluid channel through which a forced or free cooling fluid may flow. The heat transfer pins are arranged around the central fluid channel with a flow space provided between adjacent pins, allowing for some portion of the central fluid channel flow to divert through the flow space. The arrangement reduces the pressure drop of the flow through the fins, optimizes average heat transfer coefficients, reduces contact and fin-pin resistances, and reduces the physical footprint of the heat sink in an operating environment.
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