Invention Grant
- Patent Title: Heat dissipation module
- Patent Title (中): 散热模块
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Application No.: US13433308Application Date: 2012-03-29
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Publication No.: US09010406B2Publication Date: 2015-04-21
- Inventor: Yu-Hsuan Wang , Chung-Kai Hsu , Chia-Yang Liu
- Applicant: Yu-Hsuan Wang , Chung-Kai Hsu , Chia-Yang Liu
- Applicant Address: TW New Taipei
- Assignee: Foxconn Technology Co., Ltd.
- Current Assignee: Foxconn Technology Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: TW100149144A 20111228
- Main IPC: F28D15/02
- IPC: F28D15/02

Abstract:
A heat dissipation module includes a fan, a heat sink and a heat pipe. The fan defines an air outlet at one side thereof. The duct extends from the fan and away from the air outlet. The duct includes a first open end communicating with the fan and a second open end adjacent to a heat generating component. The located is located at the air outlet of the fan. The heat pipe thermally interconnects the heat sink and the heat generating component. The duct guides a part of airflow generated by the fan to the heat generating component during operation of the fan.
Public/Granted literature
- US20130168047A1 HEAT DISSIPATION MODULE Public/Granted day:2013-07-04
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