Invention Grant
- Patent Title: Solder joint reflow process for reducing packaging failure rate
- Patent Title (中): 焊接回流工艺，降低包装故障率
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Application No.: US12987702Application Date: 2011-01-10
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Publication No.: US09010617B2Publication Date: 2015-04-21
- Inventor: Chen-Hua Yu , Wen-Yao Chang , Chien Rhone Wang , Kewei Zuo , Chung-Shi Liu
- Applicant: Chen-Hua Yu , Wen-Yao Chang , Chien Rhone Wang , Kewei Zuo , Chung-Shi Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: B23K31/02
- IPC: B23K31/02 ; H01L21/44 ; H01L23/00
Abstract:
In a reflow process, a plurality of solder bumps between a first workpiece and a second workpiece is melted. During a solidification stage of the plurality of solder bumps, the plurality of solder bumps is cooled at a first cooling rate. After the solidification stage is finished, the plurality of solder bumps is cooled at a second cooling rate lower than the first cooling rate.
Public/Granted literature
- US20120175403A1 Solder Joint Reflow Process for Reducing Packaging Failure Rate Public/Granted day:2012-07-12
Information query
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