Invention Grant
- Patent Title: Fluid filled vibration damping device
- Patent Title (中): 流体填充减震装置
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Application No.: US14274017Application Date: 2014-05-09
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Publication No.: US09010738B2Publication Date: 2015-04-21
- Inventor: Satoki Koga , Chiyaki Inoue , Takehiro Okanaka
- Applicant: Tokai Rubber Industries, Ltd.
- Applicant Address: JP Komaki
- Assignee: Sumitomo Riko Company Limited
- Current Assignee: Sumitomo Riko Company Limited
- Current Assignee Address: JP Komaki
- Agency: Oliff PLC
- Priority: JP2012-067789 20120323
- Main IPC: F16F13/00
- IPC: F16F13/00 ; F16F13/10

Abstract:
A post-formation filling type fluid filled vibration damping device wherein a first communication groove, which interconnects a plurality of through holes, is formed in a partition member that separates a pressure receiving chamber and an equilibrium chamber, the groove being formed in a surface of the partition member that opposes a flexible membrane. In addition, a second communication groove, which connects an orifice passage and at least one of the plurality of through holes, is formed in the surface of the partition member that opposes the flexible membrane.
Public/Granted literature
- US20140246821A1 FLUID FILLED VIBRATION DAMPING DEVICE Public/Granted day:2014-09-04
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