Invention Grant
- Patent Title: Spindle unit
- Patent Title (中): 主轴单元
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Application No.: US13914770Application Date: 2013-06-11
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Publication No.: US09011007B2Publication Date: 2015-04-21
- Inventor: Shigeru Matsunaga , Toshiyuki Okita , Ryota Tanase
- Applicant: JTEKT Corporation
- Applicant Address: JP Osaka-shi
- Assignee: JTEKT Corporation
- Current Assignee: JTEKT Corporation
- Current Assignee Address: JP Osaka-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-137526 20120619
- Main IPC: F16C32/06
- IPC: F16C32/06 ; F16C27/04 ; B23Q1/38 ; B23Q1/70 ; B23Q11/00 ; F16C21/00

Abstract:
A spindle unit includes: a main spindle that holds a rotary tool, and that is rotated; bearings by which the main spindle is rotatably supported; and a damper bearing by which the main spindle is rotatably supported, and that has a damping coefficient larger than damping coefficients of the bearings. The damping coefficient of the damper bearing is set to a value within a range from 10,000 to 1,000,000 N·s/m.
Public/Granted literature
- US20130336603A1 SPINDLE UNIT Public/Granted day:2013-12-19
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