Invention Grant
- Patent Title: Substrate processing method
- Patent Title (中): 基板加工方法
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Application No.: US13449409Application Date: 2012-04-18
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Publication No.: US09011075B2Publication Date: 2015-04-21
- Inventor: Hiromitsu Sakaue , Takashi Horiuchi
- Applicant: Hiromitsu Sakaue , Takashi Horiuchi
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2009-064171 20090317
- Main IPC: H01L21/677
- IPC: H01L21/677

Abstract:
A substrate processing method includes transferring unprocessed substrates to a first substrate holder by way of lowering a first substrate accommodation unit and loading the unprocessed substrates into a processing chamber in sequence while sequentially rotating a substrate mounting table at a preset angle in one direction, performing a preset process on substrates in a batch-type, and unloading processed substrates from the processing chamber by the first substrate holder after a completion of the preset process, transferring the processed substrates into the first substrate accommodation unit from the first substrate holder by way of raising the first substrate accommodation unit, transferring unprocessed substrates to a second substrate holder by way of lowering a second substrate accommodation unit and loading the unprocessed substrate into the processing chamber in sequence while sequentially rotating the substrate mounting table at the preset angle in the another direction.
Public/Granted literature
- US20120201646A1 SUBSTRATE PROCESSING METHOD Public/Granted day:2012-08-09
Information query
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