Invention Grant
- Patent Title: High speed bypass cable assembly
- Patent Title (中): 高速旁路电缆组件
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Application No.: US13987296Application Date: 2011-02-14
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Publication No.: US09011177B2Publication Date: 2015-04-21
- Inventor: Brian Keith Lloyd , Christopher David Hirschy , Munawar Ahmad , Eran J. Jones , Stephen W. Hamblin , Darian Ross Schulz , Todd David Ward , Gregory B. Walz , Ebrahim Abunasrah , Rehan M. Khan
- Applicant: Brian Keith Lloyd , Christopher David Hirschy , Munawar Ahmad , Eran J. Jones , Stephen W. Hamblin , Darian Ross Schulz , Todd David Ward , Gregory B. Walz , Ebrahim Abunasrah , Rehan M. Khan
- Applicant Address: US IL Lisle
- Assignee: Molex Incorporated
- Current Assignee: Molex Incorporated
- Current Assignee Address: US IL Lisle
- Agent Timothy M. Morella
- Main IPC: H01R13/58
- IPC: H01R13/58 ; H01B11/00 ; H01R13/6593 ; H05K1/02 ; H05K3/22

Abstract:
A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted connector and the chip member, or closely proximate thereto to replicate closely the geometry of the cable. The connector terminals are arranged in alignment with the cable signal conductors and shield extensions are provided so that shielding can be provided up to and over the termination between the cable signal conductors and the board connector terminal tails. Likewise, a similar termination structure is provided at the opposite end of the cable where a pair of terminals are supported by a second connector body and enclosed in a shield collar. The shield collar has an extension that engages the second end of the cable.
Public/Granted literature
- US20140041937A1 High Speed Bypass Cable Assembly Public/Granted day:2014-02-13
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