Invention Grant
- Patent Title: Super abrasive wheel with dispensing capability, method of manufacturing wafer using the same, and wafer
- Patent Title (中): 超级砂轮,使用其的晶片的制造方法和晶片
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Application No.: US13519210Application Date: 2010-06-09
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Publication No.: US09011206B2Publication Date: 2015-04-21
- Inventor: Tomohiro Ishizu , Yukio Okanishi , Teruyuki Kumazawa
- Applicant: Tomohiro Ishizu , Yukio Okanishi , Teruyuki Kumazawa
- Applicant Address: JP Tokyo
- Assignee: A.L.M.T. Corp.
- Current Assignee: A.L.M.T. Corp.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2010-004998 20100113
- International Application: PCT/JP2010/059748 WO 20100609
- International Announcement: WO2011/086715 WO 20110721
- Main IPC: B24D7/18
- IPC: B24D7/18 ; B24D7/06 ; B24D7/10 ; B24B7/22

Abstract:
The super abrasive wheel includes a core rotating around a rotation axis and a super abrasive layer bonded to the core. The core has a first surface and a second surface located opposite to the first surface. An annular first protrusion portion protruding in the direction away from the first surface is provided at a portion of the second surface that is surrounded with the super abrasive layer. A reference surface is provided in the second surface on the inside of the first protrusion portion. The height from the reference surface to the first protrusion portion is denoted as A. A top portion having the height B from the reference surface is provided at a portion of the second surface between the first protrusion portion and the super abrasive layer. The height B is greater than the height A.
Public/Granted literature
- US20120288677A1 SUPER ABRASIVE WHEEL, METHOD OF MANUFACTURING WAFER USING THE SAME, AND WAFER Public/Granted day:2012-11-15
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