Invention Grant
US09011206B2 Super abrasive wheel with dispensing capability, method of manufacturing wafer using the same, and wafer 有权
超级砂轮,使用其的晶片的制造方法和晶片

Super abrasive wheel with dispensing capability, method of manufacturing wafer using the same, and wafer
Abstract:
The super abrasive wheel includes a core rotating around a rotation axis and a super abrasive layer bonded to the core. The core has a first surface and a second surface located opposite to the first surface. An annular first protrusion portion protruding in the direction away from the first surface is provided at a portion of the second surface that is surrounded with the super abrasive layer. A reference surface is provided in the second surface on the inside of the first protrusion portion. The height from the reference surface to the first protrusion portion is denoted as A. A top portion having the height B from the reference surface is provided at a portion of the second surface between the first protrusion portion and the super abrasive layer. The height B is greater than the height A.
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