Disclosed herein is sandpaper that includes a first plurality of particles having a first grain size, the first plurality of particles having a first sanding surface covering a first area of the sandpaper. The sandpaper includes a second plurality of particles having a second grain size that is smaller than the first grain size, the second plurality of particles having a second sanding surface covering a second area of the sandpaper. Further, the sandpaper includes a bonding layer having a back surface located opposite the first sanding surface and second sanding surface and a buffer positioned to raise the second plurality of particles such that the first sanding surface and the second sanding surface of the sandpaper are substantially planar.