Invention Grant
- Patent Title: Prosthetic device with damper
- Patent Title (中): 假体装置带阻尼器
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Application No.: US13975950Application Date: 2013-08-26
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Publication No.: US09011548B2Publication Date: 2015-04-21
- Inventor: Robert Metzger , Brian A. Uthgenannt
- Applicant: Biomet Manufacturing, LLC
- Applicant Address: US IN Warsaw
- Assignee: Biomet Manufacturing, LLC
- Current Assignee: Biomet Manufacturing, LLC
- Current Assignee Address: US IN Warsaw
- Agency: Harness, Dickey
- Main IPC: A61F2/38
- IPC: A61F2/38 ; A61F2/30

Abstract:
A prosthetic joint assembly supports articulation of a joint. The joint assembly includes a first component configured to be fixed to an anatomical feature. The first component includes a first impact surface and a second component that engages the first component. The second component includes a second impact surface that impacts the first impact surface as the first component moves relative to the second component. Furthermore, at least one of the first impact surface and the second impact surface includes a dampening member that dampens energy resulting from impact of the first and second impact surfaces.
Public/Granted literature
- US20130345819A1 Prosthetic Device With No Damper Public/Granted day:2013-12-26
Information query
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