Invention Grant
- Patent Title: Method of temperature determination for deposition reactors
- Patent Title (中): 沉积反应器温度测定方法
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Application No.: US12835789Application Date: 2010-07-14
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Publication No.: US09011599B2Publication Date: 2015-04-21
- Inventor: Jhi-Cherng Lu , Jr-Hung Li , Chii-Horng Li , Pang-Yen Tsai , Bing-Hung Chen , Tze-Liang Lee
- Applicant: Jhi-Cherng Lu , Jr-Hung Li , Chii-Horng Li , Pang-Yen Tsai , Bing-Hung Chen , Tze-Liang Lee
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: C30B25/08
- IPC: C30B25/08 ; C30B25/16 ; C30B29/06 ; C30B29/08 ; C30B29/52 ; H01L21/02 ; H01L21/66

Abstract:
A method of determining a temperature in a deposition reactor includes the steps of depositing a first epitaxial layer of silicon germanium on a substrate, depositing a second epitaxial layer of silicon above the first epitaxial layer, measuring the thickness of the second epitaxial layer and determining the temperature in the deposition reactor using the measured thickness of the second epitaxial layer. The method may also include heating the deposition reactor to approximately a predetermined temperature using a heating device and a temperature measuring device and generating a signal indicative of a temperature within the deposition reactor. The method may also contain the steps of comparing the measured thickness with a predetermined thickness of the second epitaxial layer corresponding to the predetermined temperature and determining the temperature in the deposition reactor using the measured thickness of the second epitaxial layer and the predetermined thickness of the second epitaxial layer.
Public/Granted literature
- US20120012047A1 METHOD OF TEMPERATURE DETERMINATION FOR DEPOSITION REACTORS Public/Granted day:2012-01-19
Information query
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