Invention Grant
- Patent Title: Support disk fixing apparatus, manufacturing method for a semiconductor device using this apparatus, and semiconductor manufacturing apparatus
- Patent Title (中): 支撑盘定影装置，使用该装置的半导体装置的制造方法以及半导体制造装置
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Application No.: US14058630Application Date: 2013-10-21
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Publication No.: US09011632B2Publication Date: 2015-04-21
- Inventor: Taichi Yoshida
- Applicant: Taichi Yoshida
- Applicant Address: JP Tokyo
- Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2012-243024 20121102
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01L21/683 ; H01L21/762 ; H01L21/673
Abstract:
A support disk fixing apparatus which includes an upper surface to which a wafer is bonded, a lower surface, a cylindrical side surface between the upper surface and the lower surface, and a chamfered portion between the upper surface and the side surface, includes a base upon which the support disk is placed; and a fixture that is provided on the base, and that has a first surface that abuts against the side surface of the support disk and covers the side surface of the support disk, and a second surface that abuts against the chamfered portion of the support disk and covers the chamfered portion of the support disk.
Public/Granted literature
Information query
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